中文:《光互連的機遇:市場和技術預測--2013-2020》(第一卷:板對板和機架到機架)
《光互連的機遇:市場和技術預測--2013-2020》(第二卷:On-Chip和Chip-to-Chip)
英文:Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013-2020(Volume I: Board-to-Board and Rack-to-Rack)
發(fā)布時間:2013年5月30日
報告篇幅:150頁
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在過去幾年里,光互連(Optical Interconnect)業(yè)務獲得許多刺激機會。隨著全新種類的數據流比如3D視頻、大數據和社交網絡等開始占據主導地位,市場對數據中心和本地網絡的需求加速。與此同時,我們已經看到了云計算的興起,這種網絡架構從根本上改變了進行計算的方式。
一些觀察者認為,當代I/O技術已經不能應對這一變化,并且日益感受到新型流量和做網絡的新方式的壓力。傳統(tǒng)I/O技術發(fā)展正阻礙流量增長,更糟糕的是,傳統(tǒng)銅I/O技術的功耗與現(xiàn)今數據中心中綠色計算和節(jié)省能源成本的目標背道而馳。
CIR認為,這些趨勢將推動光互連及相關產品制造商的業(yè)務發(fā)展,他們現(xiàn)在面臨著巨大的目標市場--企業(yè)服務器和大型路由器---曾經這只是他們的利基市場。此報告旨在為將未來光互連市場作為發(fā)展策略的企業(yè)(包括光模塊制造商、連接器制造商、光纖廠商或計算和電信公司等)提供指導。
此外,該報告還分析了光互連技術的演進,包括AOC(有源光纜)在光互連空間中的作用、最終朝著波導背板(waveguide backplanes)的轉移以及其它先進光技術。在8年預測期中,該報告還量化了這些機遇將帶來多少價值。
Executive Summary
執(zhí)行者摘要
E.1 Factors Driving Optical Interconnection
E.1.1 The Next Five Years
E.1.2 The Next Ten Years
E.1.3 and Beyond
E.2 Key Challenges for the Optical Interconnect Market
E.3 Technology/Product Trends and Opportunities
E.3.1 AOCs and OICs
E.3.2 At Long Last Optical Integration?
E.3.3 Laser Makers: Optical Integration and the Semiconductor Laser Roadmap
E.3.4 OIC Cable and Connector Opportunities: Are there Any?
E.4 Optical Interconnect Product Strategies: One Size Does Not Fit All
E.3 Firms to Watch
E.3.1 Analysis of OIC Strategies of Mainstream Optical Module Firms
E.3.2 Start-Up Opportunities in the OIC Space
E.4 Summary of Forecasts
Chapter One: Introduction
第一章:報告簡介
1.1 Background to this Report
1.2 Objectives of this Report
1.3 Scope of this Report
1.4 Methodology and Information Sources for this Report
1.5 Plan of this Report
Chapter Two: Current and Future Markets for Optical Interconnects
第二章:當前和未來的光互連市場
2.1 Bandwidth, Processor Speeds and the Need for Optical Interconnects
2.1.1 Will Network Traffic Overwhelm Facilities and How Optical Interconnects Can Help
2.1.2 How Server and HPC I/O Can Drive the Optical Interconnect Market
2.1.3 Petascale and Exascale Computing
2.1.4 OICs and the Rise of Clouds
2.2 Equipment-Level Opportunities for OICs
2.2.2 OIC Needs for Rack-based Systems
2.2.3 OICs in the Server Cluster
2.2.4 OICs in SANs
2.2.5 VSR Telecom and Optical Interconnection
2.2.6 Increasing Role of Optical Interconnection for Redundancy and Disaster Recovery
2.3 Board-level Opportunities for Optical Interconnects
2.3.1 On-board and Board-to-board Communications: The OIC Opportunity
2.3.2 Board-to-Board Cable Assemblies
2.3.3 Motherboards and Daughter Boards
2.3.4 Backplanes
2.4 OICs and Fiber-to-the Desk
2.5 Overview of Future Directions and Opportunities for OICs
2.5.1 Chip-to-Chip
2.5.2 Multi-core Processors
2.5.3 Optical Transceivers
2.6 Key Points from this Chapter
Chapter Three: Optical Interconnect Products and Technology Roadmaps
第三章:光互連產品和技術路線圖
3.1 High-Performance Copper Interconnects and Backplanes: End of the Road?
3.1.1 Power Consumption: Copper Killer
3.1.2 Physical Factors: Fabrication and Termination
3.1.3 Copper Cost Challenges
3.1.4 Channel Density
3.2 Optical Interconnects, MSA and Standards
3.2.1 Mature Interconnection Markets: Below 100 Gbps
3.2.2 Optical Interconnects in the 100 Gbps Environment
3.2.3 Optical Interconnects as a Terapipe
3.2.4 Optical Interconnects, Reach and VSR Standards
3.3 Enabling Technologies and Product Designs for OICs
3.3.1 Fiber Links and Flex Shuffle Backplanes
3.3.2 Active Optical Cables (AOCs)
3.3.3 Fiber Optic Engines and Fiber Backplanes
3.3.4 OICs and Space Division Multiplexing
3.3.5 POF and OICs
3.3.6 The Future: Waveguide Backplanes, WDM Interconnects and OFDM
3.4 Impact of Photonic Integration and Silicon Photonics
3.5 Optical Interconnection and Novel Laser Types: Silicon and Quantum Dot
3.6 Related Receiver and Modulator Trends
3.7 Impact of HPC Technology Initiatives
Chapter Four: Five-Year Forecasts of Optical Interconnection Markets
第四章:光互連市場五年預測
4.1 Forecasting Methodology
4.1.1 Data Sources
4.1.2 Networking/IT Expenditure Scenarios
4.2 Alternative Scenarios
4.3 Eight-Year Forecast of Rack-based Optical Interconnection by Product Type
4.3.1 Breakout by Type of Location
4.3.1 Breakout by Reach
4.3.2 Breakout by Technology
4.4 Eight-Year Forecast of Board-based Optical Interconnection by Product Type
4.3.1 Breakout by Type of Location
4.3.2 Breakout by Reach
4.3.3 Breakout by Technology
4.5 Summary of Forecasts for Optical Interconnection
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