OFC 2024 | ficonTEC：開啟集成光子學新篇章，引領未來需求新浪潮

        ICC訊  2024年3月在美國圣地亞哥舉辦的光纖通訊展覽會創(chuàng)下了參展商與觀展人數(shù)新紀錄，這標志著在AI技術迅猛發(fā)展一年之后，光通訊和網絡產業(yè)迎來了繁榮和飛速進步的新篇章。

        OFC 2024 celebrates unprecedented visitor and exhibitor numbers and spotlights a thriving and rapidly evolving optical communications and networking industry following a year of intensive AI development

        通過OFC展，我們見證了一場充滿活力且鼓舞人心的技術展示，再次確認了OFC作為全球光通訊和網絡行業(yè)首屈一指的活動地位。相比2023年，本屆展會參展商數(shù)量同比增長近四分之一，吸引了約12500名國際觀眾。展會的焦點議題涵蓋了800ZR、相干PON、線性可插拔光學（LPO）、多芯光纖、人工智能（AI）、數(shù)據中心技術和量子網絡等。

        At a very well visited and highly inspiring technology showcase display, OFC 2024 has again solidified the OFC conference’s status as the premier global event for optical networking and communications. With exhibitor numbers up almost a quarter year-on-year and some 12,500 international registered visitors, the most significant focus topics included 800ZR, Coherent PON, Linear Pluggable Optics (LPO), multicore fiber, artificial intelligence (AI), data center technology and quantum networking.

        基于集成光子學和相關PIC器件（例如可插拔的CPO共封裝光學器件）應用的光學互聯(lián)技術，已經成為行業(yè)重要的技術基石之一—ficonTEC也已在其技術路徑上部署了高效的生產設備。然而，由于大規(guī)模生成式人工智能網絡的需求對市場的直接影響，集成光子學的作用也正在經歷一個關鍵的優(yōu)先級變化。也就是說，隨著市場對數(shù)據中心架構組件的需求日益激增，硬件的更新迭代速度也在不斷加快。

        Optical interconnects based on the utilization of integrated photonics and the associated PIC devices (e.g. in the form of co-packaged optics (CPO) for pluggables) already represent a vital technology cornerstone – a technology approach for which ficonTEC already has active production systems in the field. However, as a direct consequence of a marketplace now propelled by large-scale generative AI network demand, the role of integrated photonics is now undergoing a pivotal change in priority – that is, the surge in interest for the various components that make up data center architecture is also accompanied by an acceleration in the pace of hardware updates.

        為了應對這一挑戰(zhàn)，關鍵在于推進集成光子技術的規(guī)模化以及提高批量生產能力。而這一點目前還尚未得到充分重視，亟需行業(yè)內眾多伙伴的緊密協(xié)作，共同實現(xiàn)未來光通訊領域原材料、組件、模塊和子系統(tǒng)生產的降本增效。

        One significant task in catering to this demand will be the scaling of integrated photonics technologies and so too their high-volume manufacturing. This is perhaps currently an underestimated challenge and one that will require close co-operation among multiple partners in the industry to enable the cost-effective manufacturing of materials, components, modules and subsystems for future optical communications.

        為了更生動展示行業(yè)內直接合作帶來的優(yōu)勢，ficonTEC在OFC 2024的展臺上還進行了現(xiàn)場演示。并通過和光子封裝和工藝開發(fā)領域領導者Silitronics Solutions, Inc.（主營業(yè)務為光子OSAT即外包半導體封裝和測試）的現(xiàn)場合作，生動展示了真實環(huán)境下的封裝流程。

        To showcase the benefits resulting from direct collaboration within the ecosystem, ficonTEC hosted live demos on its booth at OFC 2024. In one example, real-world assembly processes were demonstrated in partnership with Silitronics Solutions, Inc., the leader in photonic packaging and process development as a photonic OSAT (outsourced semi-conductor assembly and test).

        Silitronics也充分發(fā)揮了ficonTEC制造系統(tǒng)的多項核心競爭力和差異化優(yōu)勢。這些優(yōu)勢源于ficonTEC強大的研發(fā)實力及其對制造流程的深刻理解，其中包括可選的基于ML（機器學習）的流程優(yōu)化工具（ficonEDGE）以及通過虛擬機概念提供培訓和“軟開發(fā)”機會。借助這些工具，在進行協(xié)同開發(fā)后，初始概念驗證原型的周期時間已從20周減少到4周。此外，通過全面的全球化支持、培訓項目以及機器重新配置和重新定位選項所帶來的靈活性和“工業(yè)準備”能力，使這些優(yōu)勢在后期的流程中得到了進一步體現(xiàn)，從而滿足不斷變化的市場需求和產品迭代。

        Silitronics makes use of several competitive differentiators provided by ficonTEC manufacturing systems. The advantages begin with ficonTEC’s unparalleled R&D and experience-driven understanding of manufacturing processes, includes optional ML-based tools for process optimization (ficonEDGE), and provides training and ‘soft development’ opportunities via a virtual machine concept. Using these tools, and after performing collaborative co-development, the cycle time for initial proof-of-concept prototypes has been reduced from 20 to 4 weeks. Moreover, the advantages continue later in one’s own process with comprehensive global support, training programs, and the flexibility and ‘industrial readiness’ provided by machine re-configuration and re-purposing options in order to address evolving market demands and product iterations.

        與此同時，Quantifi Photonics還在展會上展示了一系列互補的光子測試解決方案，強調了“為測試而設計”的重要性。這些解決方案包括了激光源、偏振控制器、光功率計和光譜分析儀等設備，它們都是通過精心設計以便能夠無縫集成到光電子產品的裝配和包裝平臺。

        At the same time, the importance of ‘design-for-test’ was also highlighted on the booth with a range of complementary photonic test solutions exhibited by Quantifi Photonics. This display included laser sources, polarization controllers, optical power meters and optical spectrum analyzers that are all designed to be integrated into assembly and packaging platforms.

        展會上，多家企業(yè)的聯(lián)合展示也反映出了光通訊制造技術在未來實際生產中的一些重要要素。首先，隨著集成光子學在行業(yè)內和其他領域的地位日益凸顯，確保組裝、測試和封裝設備的可重復使用性成為其保持行業(yè)先進制造能力的關鍵要求。與此同時，例如由Silitronics封裝解決方案提供的OSAT和合同生產（CM）服務，也展現(xiàn)了在極短的時間內以低成本、高效益模式進行全自動批量生產的能力。最后，Quantify Photonics的測試解決方案解決了在晶圓和/或芯片級別對DUT（被測試設備）進行測試的迫切需求，確保在批量生產環(huán)境中光子器件能夠全面滿足規(guī)格要求。該解決方案不但提升了成本效益和測試產量，并支持平行測試，從而優(yōu)化測試流程。

        This type of joint presence at OFC captures some of the all-important aspects of actually manufacturing the optical communication technology of the future. Firstly, in acknowledging the growing role of integrated photonics in this and other sectors, it is clear that assembly, test and packaging equipment must remain reusable in order to retain manufacturing capacity within the respective ecosystems. At the same time, OSAT and contract manufacturing (CM) services provided e.g. by Silitronics’ packaging solutions demonstrate the ability to manufacture flexibly in a fully automated fashion and cost-effectively in high volumes in record times. Finally, Quantifi Photonics’ test solutions address the critical requirement of testing the DUT at the wafer and/or die level, and fully characterizing the photonic devices in volume manufacturing environments to make sure that they meet specifications. The focus is cost-effectiveness and test throughput, and also enabling an optimized test flow with parallel testing where possible.

        OFC展會落幕之際，ficonTEC、Silitronics、Quantifi Photonics還與多家行業(yè)伙伴包括Global Foundries、Nvidia、Broadcom和Jabil等，共同參加了一場開放性的圓桌討論。討論重點是如何在擴大PIC（光集成電路）技術生產規(guī)模的同時，保持生產效率和產品質量的領先水平，并分享了提升產量、優(yōu)化定價策略、縮短生產周期以及保證產品可靠性等方面的經驗和見解。

        To round out OFC week, ficonTEC, Silitronics and Quantifi Photonics all joined an open panel discussion with other ecosystem companies – including Global Foundries, Nvidia, Broadcom and Jabil – to provide a broader perspective on how to scale PIC technologies for high-volume production with the best yield, pricing, cycle time and quality.

        關于ficonTEC

        ficonTEC是公認的高端光電子元件和集成光子器件自動化封裝和測試設備領域的市場引領者。20多年來，ficonTEC積累了大量的工藝能力和獨有的封裝技術，可以滿足電信/數(shù)據通信/5G、高功率二極管激光組裝、從生物醫(yī)學到汽車激光雷達的物聯(lián)網傳感器設備、微光學模塊、光纖等行業(yè)細分市場的廣泛需求。ficonTEC靈活且可擴展的自動化方案，可適用于早期產品開發(fā)、新產品導入一直到大批量制造（無論是委約生產還是內部研發(fā)和生產）的定制封裝和測試解決方案。

        ficonTEC is the recognized market leader for automated assembly and testing machine systems for high-end opto-electronic components and integrated photonic devices. Considerable process capability and dedicated assembly technologies have been accumulated over more than two decades of serving the needs of a broad selection of industry segments – including telecom/datacom/5G, high-power diode laser assembly, IoT-conform sensor devices from bio-med to automotive lidar, micro-optical modules, fiber-optics and more. ficonTEC’s flexible and scalable automation options enable customized assembly and test solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume manufacturing (HVM) – regardless of whether for contract manufacturing or for in-house R&D and production.